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Flexible copper clad laminate
Coverlay
No-flow prepreg
Stiffener
Bonding film
PET laminated busbar
Smart Terminal
Rigid Materials
Automotive Materials
RF Materials
IMS and HTC materials
IC Substrate Materials
Flexible Materials
HSD Materials
Special Materials
Flexible copper clad laminate
Coverlay
No-flow prepreg
Stiffener
Bonding film
PET laminated busbar
Flexible copper clad laminate
Coverlay
No-flow prepreg
Stiffener
Bonding film
PET laminated busbar
Input Specification Values
Dk/10GHz
===Please Select===
≥4.0
3.5≤--＜4.0
3.0≤--＜3.5
2.5≤--＜3.0
＜2.5
Df/10GHz
===Please Select===
≥0.01
0.008≤--＜0.01
0.005≤--＜0.008
0.002≤--＜0.005
＜0.002
Application
===Please Select===
5G
WPC
Power battery protection board
CCM Module
Battery Module
Antenna Module
Cable
COF Module
FPM Module
LCD Module
Light-Bar Module
Medical Instrument
Multilayer Module
Rigid-Flex Module
Side Switch
Speaker Module
TP Module
Vehicle-mounted Module
Product List
Join Contrast
Product Name
Product Description
Dk/10GHz
Df/10GHz
Application
SF206B
LowDk/Df Bonding film
2.5
0.003
5G
SF315B
Halogen-free type epoxy bonding film
3.4
0.02
Multilayer Module Rigid-Flex Module
SF325B
Anti-ion Migration type bonding film
3.4
0.017
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Smart Terminal
Rigid Materials
Automotive Materials
RF Materials
IMS and HTC materials
IC Substrate Materials
Flexible Materials
HSD Materials
Special Materials