产品与市场
SF305
特点
● 不含卤素,阻燃性达到UL94 V-0级。
● 优秀的挠曲性、耐热性、尺寸稳定性和电性能。
● 满足RoHS指令要求,不含铅、汞、镉、六价铬、多溴联苯、多溴联苯醚等。
应用领域
电脑、移动电话、数码相机、摄录机、办公自动化设备等。- 产品性能
- 产品证书
- 资料下载
Items | Method | Condition | Unit | Typical Value |
---|---|---|---|---|
Peel Strength (90°) | IPC-TM-650 2.4.9D | Accepted | N/mm | 1.1 |
288℃, 5s | 1.0 | |||
Solder Resistance | IPC-TM-650 2.4.13.F | 288℃, 10s | - | No delamination |
Dimensional Stability | IPC-TM-650 2.2.4B |
After Etched |
% | -0.0684/0.0691 |
Chemical Resistance | IPC-TM-650 2.3.2G | After Chemical Exposure | % |
>85 |
Electric Strength | IPC-TM-650 2.5.6.2A | D-48/50+D-0.5/23 | KV/mm | 134 |
Volume Resistivity | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ-cm |
1.5×108 |
Surface Resistance | IPC-TM-650 2.5.17E | C-96/35/90 |
MΩ |
5×106 |
Dielectric Constant (10GHz) | SPDR | C-24/23/50 | - | 3.34 |
Dissipation Factor (10GHz) | SPDR |
C-24/23/50 |
- | 0.0191 |
Folding Endurance | JIS C-6471 |
R0.38×4.9N |
Times | >2000 |
Flammability | UL94 | E-24/125 | Rating |
V-0 |
Remarks:
1.Certified to IPC-4204/2 Copper Clad PolyimideDielectric with Epoxy Adhesive
2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.